projects / mirror_ubuntu-kernels.git / blame
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|---|---|---|
| 865e4fc0 XY |
1 | .. SPDX-License-Identifier: GPL-2.0 |
| 2 | ||
| 3 | Kernel driver intel-m10-bmc-hwmon | |
| 4 | ================================= | |
| 5 | ||
| 6 | Supported chips: | |
| 7 | ||
| 8 | * Intel MAX 10 BMC for Intel PAC N3000 | |
| 9 | ||
| 10 | Prefix: 'n3000bmc-hwmon' | |
| 11 | ||
| 12 | Author: Xu Yilun <yilun.xu@intel.com> | |
| 13 | ||
| 14 | ||
| 15 | Description | |
| 16 | ----------- | |
| 17 | ||
| 18 | This driver adds the temperature, voltage, current and power reading | |
| 19 | support for the Intel MAX 10 Board Management Controller (BMC) chip. | |
| 20 | The BMC chip is integrated in some Intel Programmable Acceleration | |
| 21 | Cards (PAC). It connects to a set of sensor chips to monitor the | |
| 22 | sensor data of different components on the board. The BMC firmware is | |
| 23 | responsible for sensor data sampling and recording in shared | |
| 24 | registers. The host driver reads the sensor data from these shared | |
| 25 | registers and exposes them to users as hwmon interfaces. | |
| 26 | ||
| 27 | The BMC chip is implemented using the Intel MAX 10 CPLD. It could be | |
| 28 | reprogramed to some variants in order to support different Intel | |
| 29 | PACs. The driver is designed to be able to distinguish between the | |
| 30 | variants, but now it only supports the BMC for Intel PAC N3000. | |
| 31 | ||
| 32 | ||
| 33 | Sysfs attributes | |
| 34 | ---------------- | |
| 35 | ||
| 36 | The following attributes are supported: | |
| 37 | ||
| 38 | - Intel MAX 10 BMC for Intel PAC N3000: | |
| 39 | ||
| 40 | ======================= ======================================================= | |
| 41 | tempX_input Temperature of the component (specified by tempX_label) | |
| 42 | tempX_max Temperature maximum setpoint of the component | |
| 43 | tempX_crit Temperature critical setpoint of the component | |
| 44 | tempX_max_hyst Hysteresis for temperature maximum of the component | |
| 45 | tempX_crit_hyst Hysteresis for temperature critical of the component | |
| 46 | temp1_label "Board Temperature" | |
| 47 | temp2_label "FPGA Die Temperature" | |
| 48 | temp3_label "QSFP0 Temperature" | |
| 49 | temp4_label "QSFP1 Temperature" | |
| 50 | temp5_label "Retimer A Temperature" | |
| 51 | temp6_label "Retimer A SerDes Temperature" | |
| 52 | temp7_label "Retimer B Temperature" | |
| 53 | temp8_label "Retimer B SerDes Temperature" | |
| 54 | ||
| 55 | inX_input Measured voltage of the component (specified by | |
| 56 | inX_label) | |
| 57 | in0_label "QSFP0 Supply Voltage" | |
| 58 | in1_label "QSFP1 Supply Voltage" | |
| 59 | in2_label "FPGA Core Voltage" | |
| 60 | in3_label "12V Backplane Voltage" | |
| 61 | in4_label "1.2V Voltage" | |
| 62 | in5_label "12V AUX Voltage" | |
| 63 | in6_label "1.8V Voltage" | |
| 64 | in7_label "3.3V Voltage" | |
| 65 | ||
| 66 | currX_input Measured current of the component (specified by | |
| 67 | currX_label) | |
| 68 | curr1_label "FPGA Core Current" | |
| 69 | curr2_label "12V Backplane Current" | |
| 70 | curr3_label "12V AUX Current" | |
| 71 | ||
| 72 | powerX_input Measured power of the component (specified by | |
| 73 | powerX_label) | |
| 74 | power1_label "Board Power" | |
| 75 | ||
| 76 | ======================= ======================================================= | |
| 77 | ||
| 78 | All the attributes are read-only. |