2 # Generic thermal sysfs drivers configuration
6 tristate "Generic Thermal sysfs driver"
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
20 prompt "Expose thermal sensors as hwmon device"
21 depends on HWMON=y || HWMON=THERMAL
24 In case a sensor is registered with the thermal
25 framework, this option will also register it
26 as a hwmon. The sensor will then have the common
27 hwmon sysfs interface.
29 Say 'Y' here if you want all thermal sensors to
30 have hwmon sysfs interface too.
34 prompt "APIs to parse thermal data out of device tree"
38 This options provides helpers to add the support to
39 read and parse thermal data definitions out of the
42 Say 'Y' here if you need to build thermal infrastructure
45 config THERMAL_WRITABLE_TRIPS
46 bool "Enable writable trip points"
48 This option allows the system integrator to choose whether
49 trip temperatures can be changed from userspace. The
50 writable trips need to be specified when setting up the
51 thermal zone but the choice here takes precedence.
53 Say 'Y' here if you would like to allow userspace tools to
54 change trip temperatures.
57 prompt "Default Thermal governor"
58 default THERMAL_DEFAULT_GOV_STEP_WISE
60 This option sets which thermal governor shall be loaded at
61 startup. If in doubt, select 'step_wise'.
63 config THERMAL_DEFAULT_GOV_STEP_WISE
65 select THERMAL_GOV_STEP_WISE
67 Use the step_wise governor as default. This throttles the
68 devices one step at a time.
70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
72 select THERMAL_GOV_FAIR_SHARE
74 Use the fair_share governor as default. This throttles the
75 devices based on their 'contribution' to a zone. The
76 contribution should be provided through platform data.
78 config THERMAL_DEFAULT_GOV_USER_SPACE
80 select THERMAL_GOV_USER_SPACE
82 Select this if you want to let the user space manage the
85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
86 bool "power_allocator"
87 select THERMAL_GOV_POWER_ALLOCATOR
89 Select this if you want to control temperature based on
90 system and device power allocation. This governor can only
91 operate on cooling devices that implement the power API.
95 config THERMAL_GOV_FAIR_SHARE
96 bool "Fair-share thermal governor"
98 Enable this to manage platform thermals using fair-share governor.
100 config THERMAL_GOV_STEP_WISE
101 bool "Step_wise thermal governor"
103 Enable this to manage platform thermals using a simple linear
106 config THERMAL_GOV_BANG_BANG
107 bool "Bang Bang thermal governor"
110 Enable this to manage platform thermals using bang bang governor.
112 Say 'Y' here if you want to use two point temperature regulation
113 used for fans without throttling. Some fan drivers depend on this
114 governor to be enabled (e.g. acerhdf).
116 config THERMAL_GOV_USER_SPACE
117 bool "User_space thermal governor"
119 Enable this to let the user space manage the platform thermals.
121 config THERMAL_GOV_POWER_ALLOCATOR
122 bool "Power allocator thermal governor"
124 Enable this to manage platform thermals by dynamically
125 allocating and limiting power to devices.
128 bool "generic cpu cooling support"
130 depends on THERMAL_OF
132 This implements the generic cpu cooling mechanism through frequency
133 reduction. An ACPI version of this already exists
134 (drivers/acpi/processor_thermal.c).
135 This will be useful for platforms using the generic thermal interface
136 and not the ACPI interface.
138 If you want this support, you should say Y here.
141 bool "Generic clock cooling support"
142 depends on COMMON_CLK
145 This entry implements the generic clock cooling mechanism through
146 frequency clipping. Typically used to cool off co-processors. The
147 device that is configured to use this cooling mechanism will be
148 controlled to reduce clock frequency whenever temperature is high.
150 config DEVFREQ_THERMAL
151 bool "Generic device cooling support"
152 depends on PM_DEVFREQ
155 This implements the generic devfreq cooling mechanism through
156 frequency reduction for devices using devfreq.
158 This will throttle the device by limiting the maximum allowed DVFS
159 frequency corresponding to the cooling level.
161 In order to use the power extensions of the cooling device,
162 devfreq should use the simple_ondemand governor.
164 If you want this support, you should say Y here.
166 config THERMAL_EMULATION
167 bool "Thermal emulation mode support"
169 Enable this option to make a emul_temp sysfs node in thermal zone
170 directory to support temperature emulation. With emulation sysfs node,
171 user can manually input temperature and test the different trip
172 threshold behaviour for simulation purpose.
174 WARNING: Be careful while enabling this option on production systems,
175 because userland can easily disable the thermal policy by simply
176 flooding this sysfs node with low temperature values.
179 tristate "Hisilicon thermal driver"
180 depends on ARCH_HISI || COMPILE_TEST
185 Enable this to plug hisilicon's thermal sensor driver into the Linux
186 thermal framework. cpufreq is used as the cooling device to throttle
187 CPUs when the passive trip is crossed.
190 tristate "Temperature sensor driver for Freescale i.MX SoCs"
191 depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
192 depends on MFD_SYSCON
195 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
196 It supports one critical trip point and one passive trip point. The
197 cpufreq is used as the cooling device to throttle CPUs when the
198 passive trip is crossed.
200 config MAX77620_THERMAL
201 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
202 depends on MFD_MAX77620
205 Support for die junction temperature warning alarm for Maxim
206 Semiconductor PMIC MAX77620 device. Device generates two alarm
207 interrupts when PMIC die temperature cross the threshold of
208 120 degC and 140 degC.
211 tristate "QorIQ Thermal Monitoring Unit"
212 depends on THERMAL_OF
215 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
216 It supports one critical trip point and one passive trip point. The
217 cpufreq is used as the cooling device to throttle CPUs when the
218 passive trip is crossed.
221 tristate "SPEAr thermal sensor driver"
222 depends on PLAT_SPEAR || COMPILE_TEST
226 Enable this to plug the SPEAr thermal sensor driver into the Linux
229 config ROCKCHIP_THERMAL
230 tristate "Rockchip thermal driver"
231 depends on ARCH_ROCKCHIP || COMPILE_TEST
232 depends on RESET_CONTROLLER
235 Rockchip thermal driver provides support for Temperature sensor
236 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
237 trip point. Cpufreq is used as the cooling device and will throttle
238 CPUs when the Temperature crosses the passive trip point.
241 tristate "Renesas R-Car thermal driver"
242 depends on ARCH_RENESAS || COMPILE_TEST
245 Enable this to plug the R-Car thermal sensor driver into the Linux
248 config KIRKWOOD_THERMAL
249 tristate "Temperature sensor on Marvell Kirkwood SoCs"
250 depends on MACH_KIRKWOOD || COMPILE_TEST
254 Support for the Kirkwood thermal sensor driver into the Linux thermal
255 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
258 tristate "Temperature sensor on Marvell Dove SoCs"
259 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
263 Support for the Dove thermal sensor driver in the Linux thermal
266 config DB8500_THERMAL
267 tristate "DB8500 thermal management"
268 depends on MFD_DB8500_PRCMU
271 Adds DB8500 thermal management implementation according to the thermal
272 management framework. A thermal zone with several trip points will be
273 created. Cooling devices can be bound to the trip points to cool this
274 thermal zone if trip points reached.
276 config ARMADA_THERMAL
277 tristate "Armada 370/XP thermal management"
278 depends on ARCH_MVEBU || COMPILE_TEST
282 Enable this option if you want to have support for thermal management
283 controller present in Armada 370 and Armada XP SoC.
285 config DB8500_CPUFREQ_COOLING
286 tristate "DB8500 cpufreq cooling"
287 depends on ARCH_U8500 || COMPILE_TEST
289 depends on CPU_THERMAL
292 Adds DB8500 cpufreq cooling devices, and these cooling devices can be
293 bound to thermal zone trip points. When a trip point reached, the
294 bound cpufreq cooling device turns active to set CPU frequency low to
297 config INTEL_POWERCLAMP
298 tristate "Intel PowerClamp idle injection driver"
301 depends on CPU_SUP_INTEL
303 Enable this to enable Intel PowerClamp idle injection driver. This
304 enforce idle time which results in more package C-state residency. The
305 user interface is exposed via generic thermal framework.
307 config THERMAL_BCM2835
308 depends on RASPBERRYPI_FIRMWARE
309 tristate "BCM2835 Thermal Driver"
311 This will enable temperature monitoring for the Broadcom BCM2835
312 chip. If built as a module, it will be called 'bcm2835-thermal'.
314 config X86_PKG_TEMP_THERMAL
315 tristate "X86 package temperature thermal driver"
316 depends on X86_THERMAL_VECTOR
317 select THERMAL_GOV_USER_SPACE
318 select THERMAL_WRITABLE_TRIPS
321 Enable this to register CPU digital sensor for package temperature as
322 thermal zone. Each package will have its own thermal zone. There are
323 two trip points which can be set by user to get notifications via thermal
324 notification methods.
326 config INTEL_SOC_DTS_IOSF_CORE
331 This is becoming a common feature for Intel SoCs to expose the additional
332 digital temperature sensors (DTSs) using side band interface (IOSF). This
333 implements the common set of helper functions to register, get temperature
334 and get/set thresholds on DTSs.
336 config INTEL_SOC_DTS_THERMAL
337 tristate "Intel SoCs DTS thermal driver"
339 select INTEL_SOC_DTS_IOSF_CORE
340 select THERMAL_WRITABLE_TRIPS
342 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
343 temperature sensor (DTS). These SoCs have two additional DTSs in
344 addition to DTSs on CPU cores. Each DTS will be registered as a
345 thermal zone. There are two trip points. One of the trip point can
346 be set by user mode programs to get notifications via Linux thermal
347 notification methods.The other trip is a critical trip point, which
348 was set by the driver based on the TJ MAX temperature.
350 config INTEL_QUARK_DTS_THERMAL
351 tristate "Intel Quark DTS thermal driver"
352 depends on X86_INTEL_QUARK
354 Enable this to register Intel Quark SoC (e.g. X1000) platform digital
355 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
356 The DTS will be registered as a thermal zone. There are two trip points:
357 hot & critical. The critical trip point default value is set by
358 underlying BIOS/Firmware.
360 menu "ACPI INT340X thermal drivers"
361 source drivers/thermal/int340x_thermal/Kconfig
364 config INTEL_BXT_PMIC_THERMAL
365 tristate "Intel Broxton PMIC thermal driver"
366 depends on X86 && INTEL_SOC_PMIC && REGMAP
368 Select this driver for Intel Broxton PMIC with ADC channels monitoring
369 system temperature measurements and alerts.
370 This driver is used for monitoring the ADC channels of PMIC and handles
371 the alert trip point interrupts and notifies the thermal framework with
372 the trip point and temperature details of the zone.
374 config INTEL_PCH_THERMAL
375 tristate "Intel PCH Thermal Reporting Driver"
376 depends on X86 && PCI
378 Enable this to support thermal reporting on certain intel PCHs.
379 Thermal reporting device will provide temperature reading,
380 programmable trip points and other information.
383 tristate "Temperature sensor driver for mediatek SoCs"
384 depends on ARCH_MEDIATEK || COMPILE_TEST
386 depends on NVMEM || NVMEM=n
387 depends on RESET_CONTROLLER
390 Enable this option if you want to have support for thermal management
391 controller present in Mediatek SoCs
393 menu "Texas Instruments thermal drivers"
394 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
396 source "drivers/thermal/ti-soc-thermal/Kconfig"
399 menu "Samsung thermal drivers"
400 depends on ARCH_EXYNOS || COMPILE_TEST
401 source "drivers/thermal/samsung/Kconfig"
404 menu "STMicroelectronics thermal drivers"
405 depends on ARCH_STI && OF
406 source "drivers/thermal/st/Kconfig"
410 tristate "Tango thermal management"
411 depends on ARCH_TANGO || COMPILE_TEST
413 Enable the Tango thermal driver, which supports the primitive
414 temperature sensor embedded in Tango chips since the SMP8758.
415 This sensor only generates a 1-bit signal to indicate whether
416 the die temperature exceeds a programmable threshold.
418 source "drivers/thermal/tegra/Kconfig"
420 config QCOM_SPMI_TEMP_ALARM
421 tristate "Qualcomm SPMI PMIC Temperature Alarm"
422 depends on OF && SPMI && IIO
425 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
426 PMIC devices. It shows up in sysfs as a thermal sensor with multiple
427 trip points. The temperature reported by the thermal sensor reflects the
428 real time die temperature if an ADC is present or an estimate of the
429 temperature based upon the over temperature stage value.
431 config GENERIC_ADC_THERMAL
432 tristate "Generic ADC based thermal sensor"
435 This enabled a thermal sysfs driver for the temperature sensor
436 which is connected to the General Purpose ADC. The ADC channel
437 is read via IIO framework and the channel information is provided
438 to this driver. This driver reports the temperature by reading ADC
439 channel and converts it to temperature based on lookup table.
441 menu "Qualcomm thermal drivers"
442 depends on (ARCH_QCOM && OF) || COMPILE_TEST
443 source "drivers/thermal/qcom/Kconfig"