drivers/thermal/Kconfig

   1 #
   2 # Generic thermal sysfs drivers configuration
   3 #
   4
   5 menuconfig THERMAL
   6         tristate "Generic Thermal sysfs driver"
   7         help
   8           Generic Thermal Sysfs driver offers a generic mechanism for
   9           thermal management. Usually it's made up of one or more thermal
  10           zone and cooling device.
  11           Each thermal zone contains its own temperature, trip points,
  12           cooling devices.
  13           All platforms with ACPI thermal support can use this driver.
  14           If you want this support, you should say Y or M here.
  15
  16 if THERMAL
  17
  18 config THERMAL_HWMON
  19         bool
  20         prompt "Expose thermal sensors as hwmon device"
  21         depends on HWMON=y || HWMON=THERMAL
  22         default y
  23         help
  24           In case a sensor is registered with the thermal
  25           framework, this option will also register it
  26           as a hwmon. The sensor will then have the common
  27           hwmon sysfs interface.
  28
  29           Say 'Y' here if you want all thermal sensors to
  30           have hwmon sysfs interface too.
  31
  32 config THERMAL_OF
  33         bool
  34         prompt "APIs to parse thermal data out of device tree"
  35         depends on OF
  36         default y
  37         help
  38           This options provides helpers to add the support to
  39           read and parse thermal data definitions out of the
  40           device tree blob.
  41
  42           Say 'Y' here if you need to build thermal infrastructure
  43           based on device tree.
  44
  45 config THERMAL_WRITABLE_TRIPS
  46         bool "Enable writable trip points"
  47         help
  48           This option allows the system integrator to choose whether
  49           trip temperatures can be changed from userspace. The
  50           writable trips need to be specified when setting up the
  51           thermal zone but the choice here takes precedence.
  52
  53           Say 'Y' here if you would like to allow userspace tools to
  54           change trip temperatures.
  55
  56 choice
  57         prompt "Default Thermal governor"
  58         default THERMAL_DEFAULT_GOV_STEP_WISE
  59         help
  60           This option sets which thermal governor shall be loaded at
  61           startup. If in doubt, select 'step_wise'.
  62
  63 config THERMAL_DEFAULT_GOV_STEP_WISE
  64         bool "step_wise"
  65         select THERMAL_GOV_STEP_WISE
  66         help
  67           Use the step_wise governor as default. This throttles the
  68           devices one step at a time.
  69
  70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
  71         bool "fair_share"
  72         select THERMAL_GOV_FAIR_SHARE
  73         help
  74           Use the fair_share governor as default. This throttles the
  75           devices based on their 'contribution' to a zone. The
  76           contribution should be provided through platform data.
  77
  78 config THERMAL_DEFAULT_GOV_USER_SPACE
  79         bool "user_space"
  80         select THERMAL_GOV_USER_SPACE
  81         help
  82           Select this if you want to let the user space manage the
  83           platform thermals.
  84
  85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  86         bool "power_allocator"
  87         select THERMAL_GOV_POWER_ALLOCATOR
  88         help
  89           Select this if you want to control temperature based on
  90           system and device power allocation. This governor can only
  91           operate on cooling devices that implement the power API.
  92
  93 endchoice
  94
  95 config THERMAL_GOV_FAIR_SHARE
  96         bool "Fair-share thermal governor"
  97         help
  98           Enable this to manage platform thermals using fair-share governor.
  99
 100 config THERMAL_GOV_STEP_WISE
 101         bool "Step_wise thermal governor"
 102         help
 103           Enable this to manage platform thermals using a simple linear
 104           governor.
 105
 106 config THERMAL_GOV_BANG_BANG
 107         bool "Bang Bang thermal governor"
 108         default n
 109         help
 110           Enable this to manage platform thermals using bang bang governor.
 111
 112           Say 'Y' here if you want to use two point temperature regulation
 113           used for fans without throttling.  Some fan drivers depend on this
 114           governor to be enabled (e.g. acerhdf).
 115
 116 config THERMAL_GOV_USER_SPACE
 117         bool "User_space thermal governor"
 118         help
 119           Enable this to let the user space manage the platform thermals.
 120
 121 config THERMAL_GOV_POWER_ALLOCATOR
 122         bool "Power allocator thermal governor"
 123         help
 124           Enable this to manage platform thermals by dynamically
 125           allocating and limiting power to devices.
 126
 127 config CPU_THERMAL
 128         bool "generic cpu cooling support"
 129         depends on CPU_FREQ
 130         depends on THERMAL_OF
 131         help
 132           This implements the generic cpu cooling mechanism through frequency
 133           reduction. An ACPI version of this already exists
 134           (drivers/acpi/processor_thermal.c).
 135           This will be useful for platforms using the generic thermal interface
 136           and not the ACPI interface.
 137
 138           If you want this support, you should say Y here.
 139
 140 config CLOCK_THERMAL
 141         bool "Generic clock cooling support"
 142         depends on COMMON_CLK
 143         depends on PM_OPP
 144         help
 145           This entry implements the generic clock cooling mechanism through
 146           frequency clipping. Typically used to cool off co-processors. The
 147           device that is configured to use this cooling mechanism will be
 148           controlled to reduce clock frequency whenever temperature is high.
 149
 150 config DEVFREQ_THERMAL
 151         bool "Generic device cooling support"
 152         depends on PM_DEVFREQ
 153         depends on PM_OPP
 154         help
 155           This implements the generic devfreq cooling mechanism through
 156           frequency reduction for devices using devfreq.
 157
 158           This will throttle the device by limiting the maximum allowed DVFS
 159           frequency corresponding to the cooling level.
 160
 161           In order to use the power extensions of the cooling device,
 162           devfreq should use the simple_ondemand governor.
 163
 164           If you want this support, you should say Y here.
 165
 166 config THERMAL_EMULATION
 167         bool "Thermal emulation mode support"
 168         help
 169           Enable this option to make a emul_temp sysfs node in thermal zone
 170           directory to support temperature emulation. With emulation sysfs node,
 171           user can manually input temperature and test the different trip
 172           threshold behaviour for simulation purpose.
 173
 174           WARNING: Be careful while enabling this option on production systems,
 175           because userland can easily disable the thermal policy by simply
 176           flooding this sysfs node with low temperature values.
 177
 178 config HISI_THERMAL
 179         tristate "Hisilicon thermal driver"
 180         depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
 181         help
 182           Enable this to plug hisilicon's thermal sensor driver into the Linux
 183           thermal framework. cpufreq is used as the cooling device to throttle
 184           CPUs when the passive trip is crossed.
 185
 186 config IMX_THERMAL
 187         tristate "Temperature sensor driver for Freescale i.MX SoCs"
 188         depends on CPU_THERMAL
 189         depends on MFD_SYSCON
 190         depends on OF
 191         help
 192           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
 193           It supports one critical trip point and one passive trip point.  The
 194           cpufreq is used as the cooling device to throttle CPUs when the
 195           passive trip is crossed.
 196
 197 config SPEAR_THERMAL
 198         bool "SPEAr thermal sensor driver"
 199         depends on PLAT_SPEAR || COMPILE_TEST
 200         depends on OF
 201         help
 202           Enable this to plug the SPEAr thermal sensor driver into the Linux
 203           thermal framework.
 204
 205 config ROCKCHIP_THERMAL
 206         tristate "Rockchip thermal driver"
 207         depends on ARCH_ROCKCHIP || COMPILE_TEST
 208         depends on RESET_CONTROLLER
 209         help
 210           Rockchip thermal driver provides support for Temperature sensor
 211           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
 212           trip point. Cpufreq is used as the cooling device and will throttle
 213           CPUs when the Temperature crosses the passive trip point.
 214
 215 config RCAR_THERMAL
 216         tristate "Renesas R-Car thermal driver"
 217         depends on ARCH_SHMOBILE || COMPILE_TEST
 218         depends on HAS_IOMEM
 219         help
 220           Enable this to plug the R-Car thermal sensor driver into the Linux
 221           thermal framework.
 222
 223 config KIRKWOOD_THERMAL
 224         tristate "Temperature sensor on Marvell Kirkwood SoCs"
 225         depends on MACH_KIRKWOOD || COMPILE_TEST
 226         depends on OF
 227         help
 228           Support for the Kirkwood thermal sensor driver into the Linux thermal
 229           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
 230
 231 config DOVE_THERMAL
 232         tristate "Temperature sensor on Marvell Dove SoCs"
 233         depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
 234         depends on OF
 235         help
 236           Support for the Dove thermal sensor driver in the Linux thermal
 237           framework.
 238
 239 config DB8500_THERMAL
 240         bool "DB8500 thermal management"
 241         depends on ARCH_U8500
 242         default y
 243         help
 244           Adds DB8500 thermal management implementation according to the thermal
 245           management framework. A thermal zone with several trip points will be
 246           created. Cooling devices can be bound to the trip points to cool this
 247           thermal zone if trip points reached.
 248
 249 config ARMADA_THERMAL
 250         tristate "Armada 370/XP thermal management"
 251         depends on ARCH_MVEBU || COMPILE_TEST
 252         depends on OF
 253         help
 254           Enable this option if you want to have support for thermal management
 255           controller present in Armada 370 and Armada XP SoC.
 256
 257 config TEGRA_SOCTHERM
 258         tristate "Tegra SOCTHERM thermal management"
 259         depends on ARCH_TEGRA
 260         help
 261           Enable this option for integrated thermal management support on NVIDIA
 262           Tegra124 systems-on-chip. The driver supports four thermal zones
 263           (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
 264           zones to manage temperatures. This option is also required for the
 265           emergency thermal reset (thermtrip) feature to function.
 266
 267 config DB8500_CPUFREQ_COOLING
 268         tristate "DB8500 cpufreq cooling"
 269         depends on ARCH_U8500
 270         depends on CPU_THERMAL
 271         default y
 272         help
 273           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
 274           bound to thermal zone trip points. When a trip point reached, the
 275           bound cpufreq cooling device turns active to set CPU frequency low to
 276           cool down the CPU.
 277
 278 config INTEL_POWERCLAMP
 279         tristate "Intel PowerClamp idle injection driver"
 280         depends on THERMAL
 281         depends on X86
 282         depends on CPU_SUP_INTEL
 283         help
 284           Enable this to enable Intel PowerClamp idle injection driver. This
 285           enforce idle time which results in more package C-state residency. The
 286           user interface is exposed via generic thermal framework.
 287
 288 config X86_PKG_TEMP_THERMAL
 289         tristate "X86 package temperature thermal driver"
 290         depends on X86_THERMAL_VECTOR
 291         select THERMAL_GOV_USER_SPACE
 292         select THERMAL_WRITABLE_TRIPS
 293         default m
 294         help
 295           Enable this to register CPU digital sensor for package temperature as
 296           thermal zone. Each package will have its own thermal zone. There are
 297           two trip points which can be set by user to get notifications via thermal
 298           notification methods.
 299
 300 config INTEL_SOC_DTS_IOSF_CORE
 301         tristate
 302         depends on X86
 303         select IOSF_MBI
 304         help
 305           This is becoming a common feature for Intel SoCs to expose the additional
 306           digital temperature sensors (DTSs) using side band interface (IOSF). This
 307           implements the common set of helper functions to register, get temperature
 308           and get/set thresholds on DTSs.
 309
 310 config INTEL_SOC_DTS_THERMAL
 311         tristate "Intel SoCs DTS thermal driver"
 312         depends on X86
 313         select INTEL_SOC_DTS_IOSF_CORE
 314         select THERMAL_WRITABLE_TRIPS
 315         help
 316           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
 317           temperature sensor (DTS). These SoCs have two additional DTSs in
 318           addition to DTSs on CPU cores. Each DTS will be registered as a
 319           thermal zone. There are two trip points. One of the trip point can
 320           be set by user mode programs to get notifications via Linux thermal
 321           notification methods.The other trip is a critical trip point, which
 322           was set by the driver based on the TJ MAX temperature.
 323
 324 config INTEL_QUARK_DTS_THERMAL
 325         tristate "Intel Quark DTS thermal driver"
 326         depends on X86_INTEL_QUARK
 327         help
 328           Enable this to register Intel Quark SoC (e.g. X1000) platform digital
 329           temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
 330           The DTS will be registered as a thermal zone. There are two trip points:
 331           hot & critical. The critical trip point default value is set by
 332           underlying BIOS/Firmware.
 333
 334 config INT340X_THERMAL
 335         tristate "ACPI INT340X thermal drivers"
 336         depends on X86 && ACPI
 337         select THERMAL_GOV_USER_SPACE
 338         select ACPI_THERMAL_REL
 339         select ACPI_FAN
 340         select INTEL_SOC_DTS_IOSF_CORE
 341         select THERMAL_WRITABLE_TRIPS
 342         help
 343           Newer laptops and tablets that use ACPI may have thermal sensors and
 344           other devices with thermal control capabilities outside the core
 345           CPU/SOC, for thermal safety reasons.
 346           They are exposed for the OS to use via the INT3400 ACPI device object
 347           as the master, and INT3401~INT340B ACPI device objects as the slaves.
 348           Enable this to expose the temperature information and cooling ability
 349           from these objects to userspace via the normal thermal framework.
 350           This means that a wide range of applications and GUI widgets can show
 351           the information to the user or use this information for making
 352           decisions. For example, the Intel Thermal Daemon can use this
 353           information to allow the user to select his laptop to run without
 354           turning on the fans.
 355
 356 config ACPI_THERMAL_REL
 357         tristate
 358         depends on ACPI
 359
 360 config INTEL_PCH_THERMAL
 361         tristate "Intel PCH Thermal Reporting Driver"
 362         depends on X86 && PCI
 363         help
 364           Enable this to support thermal reporting on certain intel PCHs.
 365           Thermal reporting device will provide temperature reading,
 366           programmable trip points and other information.
 367
 368 menu "Texas Instruments thermal drivers"
 369 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
 370 source "drivers/thermal/ti-soc-thermal/Kconfig"
 371 endmenu
 372
 373 menu "Samsung thermal drivers"
 374 depends on ARCH_EXYNOS || COMPILE_TEST
 375 source "drivers/thermal/samsung/Kconfig"
 376 endmenu
 377
 378 menu "STMicroelectronics thermal drivers"
 379 depends on ARCH_STI && OF
 380 source "drivers/thermal/st/Kconfig"
 381 endmenu
 382
 383 config QCOM_SPMI_TEMP_ALARM
 384         tristate "Qualcomm SPMI PMIC Temperature Alarm"
 385         depends on OF && SPMI && IIO
 386         select REGMAP_SPMI
 387         help
 388           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
 389           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
 390           trip points. The temperature reported by the thermal sensor reflects the
 391           real time die temperature if an ADC is present or an estimate of the
 392           temperature based upon the over temperature stage value.
 393
 394 endif