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1 #
2 # Generic thermal sysfs drivers configuration
3 #
4
5 menuconfig THERMAL
6 tristate "Generic Thermal sysfs driver"
7 help
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
12 cooling devices.
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
15
16 if THERMAL
17
18 config THERMAL_HWMON
19 bool
20 prompt "Expose thermal sensors as hwmon device"
21 depends on HWMON=y || HWMON=THERMAL
22 default y
23 help
24 In case a sensor is registered with the thermal
25 framework, this option will also register it
26 as a hwmon. The sensor will then have the common
27 hwmon sysfs interface.
28
29 Say 'Y' here if you want all thermal sensors to
30 have hwmon sysfs interface too.
31
32 config THERMAL_OF
33 bool
34 prompt "APIs to parse thermal data out of device tree"
35 depends on OF
36 default y
37 help
38 This options provides helpers to add the support to
39 read and parse thermal data definitions out of the
40 device tree blob.
41
42 Say 'Y' here if you need to build thermal infrastructure
43 based on device tree.
44
45 config THERMAL_WRITABLE_TRIPS
46 bool "Enable writable trip points"
47 help
48 This option allows the system integrator to choose whether
49 trip temperatures can be changed from userspace. The
50 writable trips need to be specified when setting up the
51 thermal zone but the choice here takes precedence.
52
53 Say 'Y' here if you would like to allow userspace tools to
54 change trip temperatures.
55
56 choice
57 prompt "Default Thermal governor"
58 default THERMAL_DEFAULT_GOV_STEP_WISE
59 help
60 This option sets which thermal governor shall be loaded at
61 startup. If in doubt, select 'step_wise'.
62
63 config THERMAL_DEFAULT_GOV_STEP_WISE
64 bool "step_wise"
65 select THERMAL_GOV_STEP_WISE
66 help
67 Use the step_wise governor as default. This throttles the
68 devices one step at a time.
69
70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
71 bool "fair_share"
72 select THERMAL_GOV_FAIR_SHARE
73 help
74 Use the fair_share governor as default. This throttles the
75 devices based on their 'contribution' to a zone. The
76 contribution should be provided through platform data.
77
78 config THERMAL_DEFAULT_GOV_USER_SPACE
79 bool "user_space"
80 select THERMAL_GOV_USER_SPACE
81 help
82 Select this if you want to let the user space manage the
83 platform thermals.
84
85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
86 bool "power_allocator"
87 select THERMAL_GOV_POWER_ALLOCATOR
88 help
89 Select this if you want to control temperature based on
90 system and device power allocation. This governor can only
91 operate on cooling devices that implement the power API.
92
93 endchoice
94
95 config THERMAL_GOV_FAIR_SHARE
96 bool "Fair-share thermal governor"
97 help
98 Enable this to manage platform thermals using fair-share governor.
99
100 config THERMAL_GOV_STEP_WISE
101 bool "Step_wise thermal governor"
102 help
103 Enable this to manage platform thermals using a simple linear
104 governor.
105
106 config THERMAL_GOV_BANG_BANG
107 bool "Bang Bang thermal governor"
108 default n
109 help
110 Enable this to manage platform thermals using bang bang governor.
111
112 Say 'Y' here if you want to use two point temperature regulation
113 used for fans without throttling. Some fan drivers depend on this
114 governor to be enabled (e.g. acerhdf).
115
116 config THERMAL_GOV_USER_SPACE
117 bool "User_space thermal governor"
118 help
119 Enable this to let the user space manage the platform thermals.
120
121 config THERMAL_GOV_POWER_ALLOCATOR
122 bool "Power allocator thermal governor"
123 help
124 Enable this to manage platform thermals by dynamically
125 allocating and limiting power to devices.
126
127 config CPU_THERMAL
128 bool "generic cpu cooling support"
129 depends on CPU_FREQ
130 depends on THERMAL_OF
131 help
132 This implements the generic cpu cooling mechanism through frequency
133 reduction. An ACPI version of this already exists
134 (drivers/acpi/processor_thermal.c).
135 This will be useful for platforms using the generic thermal interface
136 and not the ACPI interface.
137
138 If you want this support, you should say Y here.
139
140 config CLOCK_THERMAL
141 bool "Generic clock cooling support"
142 depends on COMMON_CLK
143 depends on PM_OPP
144 help
145 This entry implements the generic clock cooling mechanism through
146 frequency clipping. Typically used to cool off co-processors. The
147 device that is configured to use this cooling mechanism will be
148 controlled to reduce clock frequency whenever temperature is high.
149
150 config DEVFREQ_THERMAL
151 bool "Generic device cooling support"
152 depends on PM_DEVFREQ
153 depends on PM_OPP
154 help
155 This implements the generic devfreq cooling mechanism through
156 frequency reduction for devices using devfreq.
157
158 This will throttle the device by limiting the maximum allowed DVFS
159 frequency corresponding to the cooling level.
160
161 In order to use the power extensions of the cooling device,
162 devfreq should use the simple_ondemand governor.
163
164 If you want this support, you should say Y here.
165
166 config THERMAL_EMULATION
167 bool "Thermal emulation mode support"
168 help
169 Enable this option to make a emul_temp sysfs node in thermal zone
170 directory to support temperature emulation. With emulation sysfs node,
171 user can manually input temperature and test the different trip
172 threshold behaviour for simulation purpose.
173
174 WARNING: Be careful while enabling this option on production systems,
175 because userland can easily disable the thermal policy by simply
176 flooding this sysfs node with low temperature values.
177
178 config HISI_THERMAL
179 tristate "Hisilicon thermal driver"
180 depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
181 help
182 Enable this to plug hisilicon's thermal sensor driver into the Linux
183 thermal framework. cpufreq is used as the cooling device to throttle
184 CPUs when the passive trip is crossed.
185
186 config IMX_THERMAL
187 tristate "Temperature sensor driver for Freescale i.MX SoCs"
188 depends on CPU_THERMAL
189 depends on MFD_SYSCON
190 depends on OF
191 help
192 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
193 It supports one critical trip point and one passive trip point. The
194 cpufreq is used as the cooling device to throttle CPUs when the
195 passive trip is crossed.
196
197 config SPEAR_THERMAL
198 bool "SPEAr thermal sensor driver"
199 depends on PLAT_SPEAR || COMPILE_TEST
200 depends on OF
201 help
202 Enable this to plug the SPEAr thermal sensor driver into the Linux
203 thermal framework.
204
205 config ROCKCHIP_THERMAL
206 tristate "Rockchip thermal driver"
207 depends on ARCH_ROCKCHIP || COMPILE_TEST
208 depends on RESET_CONTROLLER
209 help
210 Rockchip thermal driver provides support for Temperature sensor
211 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
212 trip point. Cpufreq is used as the cooling device and will throttle
213 CPUs when the Temperature crosses the passive trip point.
214
215 config RCAR_THERMAL
216 tristate "Renesas R-Car thermal driver"
217 depends on ARCH_SHMOBILE || COMPILE_TEST
218 depends on HAS_IOMEM
219 help
220 Enable this to plug the R-Car thermal sensor driver into the Linux
221 thermal framework.
222
223 config KIRKWOOD_THERMAL
224 tristate "Temperature sensor on Marvell Kirkwood SoCs"
225 depends on MACH_KIRKWOOD || COMPILE_TEST
226 depends on OF
227 help
228 Support for the Kirkwood thermal sensor driver into the Linux thermal
229 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
230
231 config DOVE_THERMAL
232 tristate "Temperature sensor on Marvell Dove SoCs"
233 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
234 depends on OF
235 help
236 Support for the Dove thermal sensor driver in the Linux thermal
237 framework.
238
239 config DB8500_THERMAL
240 bool "DB8500 thermal management"
241 depends on ARCH_U8500
242 default y
243 help
244 Adds DB8500 thermal management implementation according to the thermal
245 management framework. A thermal zone with several trip points will be
246 created. Cooling devices can be bound to the trip points to cool this
247 thermal zone if trip points reached.
248
249 config ARMADA_THERMAL
250 tristate "Armada 370/XP thermal management"
251 depends on ARCH_MVEBU || COMPILE_TEST
252 depends on OF
253 help
254 Enable this option if you want to have support for thermal management
255 controller present in Armada 370 and Armada XP SoC.
256
257 config TEGRA_SOCTHERM
258 tristate "Tegra SOCTHERM thermal management"
259 depends on ARCH_TEGRA
260 help
261 Enable this option for integrated thermal management support on NVIDIA
262 Tegra124 systems-on-chip. The driver supports four thermal zones
263 (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
264 zones to manage temperatures. This option is also required for the
265 emergency thermal reset (thermtrip) feature to function.
266
267 config DB8500_CPUFREQ_COOLING
268 tristate "DB8500 cpufreq cooling"
269 depends on ARCH_U8500
270 depends on CPU_THERMAL
271 default y
272 help
273 Adds DB8500 cpufreq cooling devices, and these cooling devices can be
274 bound to thermal zone trip points. When a trip point reached, the
275 bound cpufreq cooling device turns active to set CPU frequency low to
276 cool down the CPU.
277
278 config INTEL_POWERCLAMP
279 tristate "Intel PowerClamp idle injection driver"
280 depends on THERMAL
281 depends on X86
282 depends on CPU_SUP_INTEL
283 help
284 Enable this to enable Intel PowerClamp idle injection driver. This
285 enforce idle time which results in more package C-state residency. The
286 user interface is exposed via generic thermal framework.
287
288 config X86_PKG_TEMP_THERMAL
289 tristate "X86 package temperature thermal driver"
290 depends on X86_THERMAL_VECTOR
291 select THERMAL_GOV_USER_SPACE
292 select THERMAL_WRITABLE_TRIPS
293 default m
294 help
295 Enable this to register CPU digital sensor for package temperature as
296 thermal zone. Each package will have its own thermal zone. There are
297 two trip points which can be set by user to get notifications via thermal
298 notification methods.
299
300 config INTEL_SOC_DTS_IOSF_CORE
301 tristate
302 depends on X86
303 select IOSF_MBI
304 help
305 This is becoming a common feature for Intel SoCs to expose the additional
306 digital temperature sensors (DTSs) using side band interface (IOSF). This
307 implements the common set of helper functions to register, get temperature
308 and get/set thresholds on DTSs.
309
310 config INTEL_SOC_DTS_THERMAL
311 tristate "Intel SoCs DTS thermal driver"
312 depends on X86
313 select INTEL_SOC_DTS_IOSF_CORE
314 select THERMAL_WRITABLE_TRIPS
315 help
316 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
317 temperature sensor (DTS). These SoCs have two additional DTSs in
318 addition to DTSs on CPU cores. Each DTS will be registered as a
319 thermal zone. There are two trip points. One of the trip point can
320 be set by user mode programs to get notifications via Linux thermal
321 notification methods.The other trip is a critical trip point, which
322 was set by the driver based on the TJ MAX temperature.
323
324 config INTEL_QUARK_DTS_THERMAL
325 tristate "Intel Quark DTS thermal driver"
326 depends on X86_INTEL_QUARK
327 help
328 Enable this to register Intel Quark SoC (e.g. X1000) platform digital
329 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
330 The DTS will be registered as a thermal zone. There are two trip points:
331 hot & critical. The critical trip point default value is set by
332 underlying BIOS/Firmware.
333
334 config INT340X_THERMAL
335 tristate "ACPI INT340X thermal drivers"
336 depends on X86 && ACPI
337 select THERMAL_GOV_USER_SPACE
338 select ACPI_THERMAL_REL
339 select ACPI_FAN
340 select INTEL_SOC_DTS_IOSF_CORE
341 select THERMAL_WRITABLE_TRIPS
342 help
343 Newer laptops and tablets that use ACPI may have thermal sensors and
344 other devices with thermal control capabilities outside the core
345 CPU/SOC, for thermal safety reasons.
346 They are exposed for the OS to use via the INT3400 ACPI device object
347 as the master, and INT3401~INT340B ACPI device objects as the slaves.
348 Enable this to expose the temperature information and cooling ability
349 from these objects to userspace via the normal thermal framework.
350 This means that a wide range of applications and GUI widgets can show
351 the information to the user or use this information for making
352 decisions. For example, the Intel Thermal Daemon can use this
353 information to allow the user to select his laptop to run without
354 turning on the fans.
355
356 config ACPI_THERMAL_REL
357 tristate
358 depends on ACPI
359
360 config INTEL_PCH_THERMAL
361 tristate "Intel PCH Thermal Reporting Driver"
362 depends on X86 && PCI
363 help
364 Enable this to support thermal reporting on certain intel PCHs.
365 Thermal reporting device will provide temperature reading,
366 programmable trip points and other information.
367
368 menu "Texas Instruments thermal drivers"
369 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
370 source "drivers/thermal/ti-soc-thermal/Kconfig"
371 endmenu
372
373 menu "Samsung thermal drivers"
374 depends on ARCH_EXYNOS || COMPILE_TEST
375 source "drivers/thermal/samsung/Kconfig"
376 endmenu
377
378 menu "STMicroelectronics thermal drivers"
379 depends on ARCH_STI && OF
380 source "drivers/thermal/st/Kconfig"
381 endmenu
382
383 config QCOM_SPMI_TEMP_ALARM
384 tristate "Qualcomm SPMI PMIC Temperature Alarm"
385 depends on OF && SPMI && IIO
386 select REGMAP_SPMI
387 help
388 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
389 PMIC devices. It shows up in sysfs as a thermal sensor with multiple
390 trip points. The temperature reported by the thermal sensor reflects the
391 real time die temperature if an ADC is present or an estimate of the
392 temperature based upon the over temperature stage value.
393
394 endif