drivers/thermal/Kconfig

   1 #
   2 # Generic thermal sysfs drivers configuration
   3 #
   4
   5 menuconfig THERMAL
   6         tristate "Generic Thermal sysfs driver"
   7         help
   8           Generic Thermal Sysfs driver offers a generic mechanism for
   9           thermal management. Usually it's made up of one or more thermal
  10           zone and cooling device.
  11           Each thermal zone contains its own temperature, trip points,
  12           cooling devices.
  13           All platforms with ACPI thermal support can use this driver.
  14           If you want this support, you should say Y or M here.
  15
  16 if THERMAL
  17
  18 config THERMAL_HWMON
  19         bool
  20         prompt "Expose thermal sensors as hwmon device"
  21         depends on HWMON=y || HWMON=THERMAL
  22         default y
  23         help
  24           In case a sensor is registered with the thermal
  25           framework, this option will also register it
  26           as a hwmon. The sensor will then have the common
  27           hwmon sysfs interface.
  28
  29           Say 'Y' here if you want all thermal sensors to
  30           have hwmon sysfs interface too.
  31
  32 config THERMAL_OF
  33         bool
  34         prompt "APIs to parse thermal data out of device tree"
  35         depends on OF
  36         default y
  37         help
  38           This options provides helpers to add the support to
  39           read and parse thermal data definitions out of the
  40           device tree blob.
  41
  42           Say 'Y' here if you need to build thermal infrastructure
  43           based on device tree.
  44
  45 config THERMAL_WRITABLE_TRIPS
  46         bool "Enable writable trip points"
  47         help
  48           This option allows the system integrator to choose whether
  49           trip temperatures can be changed from userspace. The
  50           writable trips need to be specified when setting up the
  51           thermal zone but the choice here takes precedence.
  52
  53           Say 'Y' here if you would like to allow userspace tools to
  54           change trip temperatures.
  55
  56 choice
  57         prompt "Default Thermal governor"
  58         default THERMAL_DEFAULT_GOV_STEP_WISE
  59         help
  60           This option sets which thermal governor shall be loaded at
  61           startup. If in doubt, select 'step_wise'.
  62
  63 config THERMAL_DEFAULT_GOV_STEP_WISE
  64         bool "step_wise"
  65         select THERMAL_GOV_STEP_WISE
  66         help
  67           Use the step_wise governor as default. This throttles the
  68           devices one step at a time.
  69
  70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
  71         bool "fair_share"
  72         select THERMAL_GOV_FAIR_SHARE
  73         help
  74           Use the fair_share governor as default. This throttles the
  75           devices based on their 'contribution' to a zone. The
  76           contribution should be provided through platform data.
  77
  78 config THERMAL_DEFAULT_GOV_USER_SPACE
  79         bool "user_space"
  80         select THERMAL_GOV_USER_SPACE
  81         help
  82           Select this if you want to let the user space manage the
  83           platform thermals.
  84
  85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  86         bool "power_allocator"
  87         select THERMAL_GOV_POWER_ALLOCATOR
  88         help
  89           Select this if you want to control temperature based on
  90           system and device power allocation. This governor can only
  91           operate on cooling devices that implement the power API.
  92
  93 endchoice
  94
  95 config THERMAL_GOV_FAIR_SHARE
  96         bool "Fair-share thermal governor"
  97         help
  98           Enable this to manage platform thermals using fair-share governor.
  99
 100 config THERMAL_GOV_STEP_WISE
 101         bool "Step_wise thermal governor"
 102         help
 103           Enable this to manage platform thermals using a simple linear
 104           governor.
 105
 106 config THERMAL_GOV_BANG_BANG
 107         bool "Bang Bang thermal governor"
 108         default n
 109         help
 110           Enable this to manage platform thermals using bang bang governor.
 111
 112           Say 'Y' here if you want to use two point temperature regulation
 113           used for fans without throttling.  Some fan drivers depend on this
 114           governor to be enabled (e.g. acerhdf).
 115
 116 config THERMAL_GOV_USER_SPACE
 117         bool "User_space thermal governor"
 118         help
 119           Enable this to let the user space manage the platform thermals.
 120
 121 config THERMAL_GOV_POWER_ALLOCATOR
 122         bool "Power allocator thermal governor"
 123         help
 124           Enable this to manage platform thermals by dynamically
 125           allocating and limiting power to devices.
 126
 127 config CPU_THERMAL
 128         bool "generic cpu cooling support"
 129         depends on CPU_FREQ
 130         depends on THERMAL_OF
 131         help
 132           This implements the generic cpu cooling mechanism through frequency
 133           reduction. An ACPI version of this already exists
 134           (drivers/acpi/processor_thermal.c).
 135           This will be useful for platforms using the generic thermal interface
 136           and not the ACPI interface.
 137
 138           If you want this support, you should say Y here.
 139
 140 config CLOCK_THERMAL
 141         bool "Generic clock cooling support"
 142         depends on COMMON_CLK
 143         depends on PM_OPP
 144         help
 145           This entry implements the generic clock cooling mechanism through
 146           frequency clipping. Typically used to cool off co-processors. The
 147           device that is configured to use this cooling mechanism will be
 148           controlled to reduce clock frequency whenever temperature is high.
 149
 150 config DEVFREQ_THERMAL
 151         bool "Generic device cooling support"
 152         depends on PM_DEVFREQ
 153         depends on PM_OPP
 154         help
 155           This implements the generic devfreq cooling mechanism through
 156           frequency reduction for devices using devfreq.
 157
 158           This will throttle the device by limiting the maximum allowed DVFS
 159           frequency corresponding to the cooling level.
 160
 161           In order to use the power extensions of the cooling device,
 162           devfreq should use the simple_ondemand governor.
 163
 164           If you want this support, you should say Y here.
 165
 166 config THERMAL_EMULATION
 167         bool "Thermal emulation mode support"
 168         help
 169           Enable this option to make a emul_temp sysfs node in thermal zone
 170           directory to support temperature emulation. With emulation sysfs node,
 171           user can manually input temperature and test the different trip
 172           threshold behaviour for simulation purpose.
 173
 174           WARNING: Be careful while enabling this option on production systems,
 175           because userland can easily disable the thermal policy by simply
 176           flooding this sysfs node with low temperature values.
 177
 178 config HISI_THERMAL
 179         tristate "Hisilicon thermal driver"
 180         depends on ARCH_HISI || COMPILE_TEST
 181         depends on HAS_IOMEM
 182         depends on OF
 183         default y
 184         help
 185           Enable this to plug hisilicon's thermal sensor driver into the Linux
 186           thermal framework. cpufreq is used as the cooling device to throttle
 187           CPUs when the passive trip is crossed.
 188
 189 config IMX_THERMAL
 190         tristate "Temperature sensor driver for Freescale i.MX SoCs"
 191         depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
 192         depends on MFD_SYSCON
 193         depends on OF
 194         help
 195           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
 196           It supports one critical trip point and one passive trip point.  The
 197           cpufreq is used as the cooling device to throttle CPUs when the
 198           passive trip is crossed.
 199
 200 config MAX77620_THERMAL
 201         tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
 202         depends on MFD_MAX77620
 203         depends on OF
 204         help
 205           Support for die junction temperature warning alarm for Maxim
 206           Semiconductor PMIC MAX77620 device. Device generates two alarm
 207           interrupts when PMIC die temperature cross the threshold of
 208           120 degC and 140 degC.
 209
 210 config QORIQ_THERMAL
 211         tristate "QorIQ Thermal Monitoring Unit"
 212         depends on THERMAL_OF
 213         depends on HAS_IOMEM
 214         help
 215           Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
 216           It supports one critical trip point and one passive trip point. The
 217           cpufreq is used as the cooling device to throttle CPUs when the
 218           passive trip is crossed.
 219
 220 config SPEAR_THERMAL
 221         tristate "SPEAr thermal sensor driver"
 222         depends on PLAT_SPEAR || COMPILE_TEST
 223         depends on HAS_IOMEM
 224         depends on OF
 225         help
 226           Enable this to plug the SPEAr thermal sensor driver into the Linux
 227           thermal framework.
 228
 229 config ROCKCHIP_THERMAL
 230         tristate "Rockchip thermal driver"
 231         depends on ARCH_ROCKCHIP || COMPILE_TEST
 232         depends on RESET_CONTROLLER
 233         depends on HAS_IOMEM
 234         help
 235           Rockchip thermal driver provides support for Temperature sensor
 236           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
 237           trip point. Cpufreq is used as the cooling device and will throttle
 238           CPUs when the Temperature crosses the passive trip point.
 239
 240 config RCAR_THERMAL
 241         tristate "Renesas R-Car thermal driver"
 242         depends on ARCH_RENESAS || COMPILE_TEST
 243         depends on HAS_IOMEM
 244         help
 245           Enable this to plug the R-Car thermal sensor driver into the Linux
 246           thermal framework.
 247
 248 config KIRKWOOD_THERMAL
 249         tristate "Temperature sensor on Marvell Kirkwood SoCs"
 250         depends on MACH_KIRKWOOD || COMPILE_TEST
 251         depends on HAS_IOMEM
 252         depends on OF
 253         help
 254           Support for the Kirkwood thermal sensor driver into the Linux thermal
 255           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
 256
 257 config DOVE_THERMAL
 258         tristate "Temperature sensor on Marvell Dove SoCs"
 259         depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
 260         depends on HAS_IOMEM
 261         depends on OF
 262         help
 263           Support for the Dove thermal sensor driver in the Linux thermal
 264           framework.
 265
 266 config DB8500_THERMAL
 267         tristate "DB8500 thermal management"
 268         depends on MFD_DB8500_PRCMU
 269         default y
 270         help
 271           Adds DB8500 thermal management implementation according to the thermal
 272           management framework. A thermal zone with several trip points will be
 273           created. Cooling devices can be bound to the trip points to cool this
 274           thermal zone if trip points reached.
 275
 276 config ARMADA_THERMAL
 277         tristate "Armada 370/XP thermal management"
 278         depends on ARCH_MVEBU || COMPILE_TEST
 279         depends on HAS_IOMEM
 280         depends on OF
 281         help
 282           Enable this option if you want to have support for thermal management
 283           controller present in Armada 370 and Armada XP SoC.
 284
 285 config DB8500_CPUFREQ_COOLING
 286         tristate "DB8500 cpufreq cooling"
 287         depends on ARCH_U8500 || COMPILE_TEST
 288         depends on HAS_IOMEM
 289         depends on CPU_THERMAL
 290         default y
 291         help
 292           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
 293           bound to thermal zone trip points. When a trip point reached, the
 294           bound cpufreq cooling device turns active to set CPU frequency low to
 295           cool down the CPU.
 296
 297 config INTEL_POWERCLAMP
 298         tristate "Intel PowerClamp idle injection driver"
 299         depends on THERMAL
 300         depends on X86
 301         depends on CPU_SUP_INTEL
 302         help
 303           Enable this to enable Intel PowerClamp idle injection driver. This
 304           enforce idle time which results in more package C-state residency. The
 305           user interface is exposed via generic thermal framework.
 306
 307 config X86_PKG_TEMP_THERMAL
 308         tristate "X86 package temperature thermal driver"
 309         depends on X86_THERMAL_VECTOR
 310         select THERMAL_GOV_USER_SPACE
 311         select THERMAL_WRITABLE_TRIPS
 312         default m
 313         help
 314           Enable this to register CPU digital sensor for package temperature as
 315           thermal zone. Each package will have its own thermal zone. There are
 316           two trip points which can be set by user to get notifications via thermal
 317           notification methods.
 318
 319 config INTEL_SOC_DTS_IOSF_CORE
 320         tristate
 321         depends on X86
 322         select IOSF_MBI
 323         help
 324           This is becoming a common feature for Intel SoCs to expose the additional
 325           digital temperature sensors (DTSs) using side band interface (IOSF). This
 326           implements the common set of helper functions to register, get temperature
 327           and get/set thresholds on DTSs.
 328
 329 config INTEL_SOC_DTS_THERMAL
 330         tristate "Intel SoCs DTS thermal driver"
 331         depends on X86
 332         select INTEL_SOC_DTS_IOSF_CORE
 333         select THERMAL_WRITABLE_TRIPS
 334         help
 335           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
 336           temperature sensor (DTS). These SoCs have two additional DTSs in
 337           addition to DTSs on CPU cores. Each DTS will be registered as a
 338           thermal zone. There are two trip points. One of the trip point can
 339           be set by user mode programs to get notifications via Linux thermal
 340           notification methods.The other trip is a critical trip point, which
 341           was set by the driver based on the TJ MAX temperature.
 342
 343 config INTEL_QUARK_DTS_THERMAL
 344         tristate "Intel Quark DTS thermal driver"
 345         depends on X86_INTEL_QUARK
 346         help
 347           Enable this to register Intel Quark SoC (e.g. X1000) platform digital
 348           temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
 349           The DTS will be registered as a thermal zone. There are two trip points:
 350           hot & critical. The critical trip point default value is set by
 351           underlying BIOS/Firmware.
 352
 353 menu "ACPI INT340X thermal drivers"
 354 source drivers/thermal/int340x_thermal/Kconfig
 355 endmenu
 356
 357 config INTEL_BXT_PMIC_THERMAL
 358         tristate "Intel Broxton PMIC thermal driver"
 359         depends on X86 && INTEL_SOC_PMIC && REGMAP
 360         help
 361           Select this driver for Intel Broxton PMIC with ADC channels monitoring
 362           system temperature measurements and alerts.
 363           This driver is used for monitoring the ADC channels of PMIC and handles
 364           the alert trip point interrupts and notifies the thermal framework with
 365           the trip point and temperature details of the zone.
 366
 367 config INTEL_PCH_THERMAL
 368         tristate "Intel PCH Thermal Reporting Driver"
 369         depends on X86 && PCI
 370         help
 371           Enable this to support thermal reporting on certain intel PCHs.
 372           Thermal reporting device will provide temperature reading,
 373           programmable trip points and other information.
 374
 375 config MTK_THERMAL
 376         tristate "Temperature sensor driver for mediatek SoCs"
 377         depends on ARCH_MEDIATEK || COMPILE_TEST
 378         depends on HAS_IOMEM
 379         depends on NVMEM || NVMEM=n
 380         depends on RESET_CONTROLLER
 381         default y
 382         help
 383           Enable this option if you want to have support for thermal management
 384           controller present in Mediatek SoCs
 385
 386 menu "Texas Instruments thermal drivers"
 387 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
 388 depends on HAS_IOMEM
 389 source "drivers/thermal/ti-soc-thermal/Kconfig"
 390 endmenu
 391
 392 menu "Samsung thermal drivers"
 393 depends on ARCH_EXYNOS || COMPILE_TEST
 394 source "drivers/thermal/samsung/Kconfig"
 395 endmenu
 396
 397 menu "STMicroelectronics thermal drivers"
 398 depends on ARCH_STI && OF
 399 source "drivers/thermal/st/Kconfig"
 400 endmenu
 401
 402 config TANGO_THERMAL
 403         tristate "Tango thermal management"
 404         depends on ARCH_TANGO || COMPILE_TEST
 405         help
 406           Enable the Tango thermal driver, which supports the primitive
 407           temperature sensor embedded in Tango chips since the SMP8758.
 408           This sensor only generates a 1-bit signal to indicate whether
 409           the die temperature exceeds a programmable threshold.
 410
 411 source "drivers/thermal/tegra/Kconfig"
 412
 413 config QCOM_SPMI_TEMP_ALARM
 414         tristate "Qualcomm SPMI PMIC Temperature Alarm"
 415         depends on OF && SPMI && IIO
 416         select REGMAP_SPMI
 417         help
 418           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
 419           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
 420           trip points. The temperature reported by the thermal sensor reflects the
 421           real time die temperature if an ADC is present or an estimate of the
 422           temperature based upon the over temperature stage value.
 423
 424 config GENERIC_ADC_THERMAL
 425         tristate "Generic ADC based thermal sensor"
 426         depends on IIO
 427         help
 428           This enabled a thermal sysfs driver for the temperature sensor
 429           which is connected to the General Purpose ADC. The ADC channel
 430           is read via IIO framework and the channel information is provided
 431           to this driver. This driver reports the temperature by reading ADC
 432           channel and converts it to temperature based on lookup table.
 433
 434 menu "Qualcomm thermal drivers"
 435 depends on (ARCH_QCOM && OF) || COMPILE_TEST
 436 source "drivers/thermal/qcom/Kconfig"
 437 endmenu
 438
 439 endif