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1 # SPDX-License-Identifier: GPL-2.0-only
2 #
3 # Generic thermal sysfs drivers configuration
4 #
5
6 menuconfig THERMAL
7 bool "Generic Thermal sysfs driver"
8 help
9 Generic Thermal Sysfs driver offers a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zone and cooling device.
12 Each thermal zone contains its own temperature, trip points,
13 cooling devices.
14 All platforms with ACPI thermal support can use this driver.
15 If you want this support, you should say Y here.
16
17 if THERMAL
18
19 config THERMAL_STATISTICS
20 bool "Thermal state transition statistics"
21 help
22 Export thermal state transition statistics information through sysfs.
23
24 If in doubt, say N.
25
26 config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
27 int "Emergency poweroff delay in milli-seconds"
28 default 0
29 help
30 Thermal subsystem will issue a graceful shutdown when
31 critical temperatures are reached using orderly_poweroff(). In
32 case of failure of an orderly_poweroff(), the thermal emergency
33 poweroff kicks in after a delay has elapsed and shuts down the system.
34 This config is number of milliseconds to delay before emergency
35 poweroff kicks in. Similarly to the critical trip point,
36 the delay should be carefully profiled so as to give adequate
37 time for orderly_poweroff() to finish on regular execution.
38 If set to 0 emergency poweroff will not be supported.
39
40 In doubt, leave as 0.
41
42 config THERMAL_HWMON
43 bool
44 prompt "Expose thermal sensors as hwmon device"
45 depends on HWMON=y || HWMON=THERMAL
46 default y
47 help
48 In case a sensor is registered with the thermal
49 framework, this option will also register it
50 as a hwmon. The sensor will then have the common
51 hwmon sysfs interface.
52
53 Say 'Y' here if you want all thermal sensors to
54 have hwmon sysfs interface too.
55
56 config THERMAL_OF
57 bool
58 prompt "APIs to parse thermal data out of device tree"
59 depends on OF
60 default y
61 help
62 This options provides helpers to add the support to
63 read and parse thermal data definitions out of the
64 device tree blob.
65
66 Say 'Y' here if you need to build thermal infrastructure
67 based on device tree.
68
69 config THERMAL_WRITABLE_TRIPS
70 bool "Enable writable trip points"
71 help
72 This option allows the system integrator to choose whether
73 trip temperatures can be changed from userspace. The
74 writable trips need to be specified when setting up the
75 thermal zone but the choice here takes precedence.
76
77 Say 'Y' here if you would like to allow userspace tools to
78 change trip temperatures.
79
80 choice
81 prompt "Default Thermal governor"
82 default THERMAL_DEFAULT_GOV_STEP_WISE
83 help
84 This option sets which thermal governor shall be loaded at
85 startup. If in doubt, select 'step_wise'.
86
87 config THERMAL_DEFAULT_GOV_STEP_WISE
88 bool "step_wise"
89 select THERMAL_GOV_STEP_WISE
90 help
91 Use the step_wise governor as default. This throttles the
92 devices one step at a time.
93
94 config THERMAL_DEFAULT_GOV_FAIR_SHARE
95 bool "fair_share"
96 select THERMAL_GOV_FAIR_SHARE
97 help
98 Use the fair_share governor as default. This throttles the
99 devices based on their 'contribution' to a zone. The
100 contribution should be provided through platform data.
101
102 config THERMAL_DEFAULT_GOV_USER_SPACE
103 bool "user_space"
104 select THERMAL_GOV_USER_SPACE
105 help
106 Select this if you want to let the user space manage the
107 platform thermals.
108
109 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
110 bool "power_allocator"
111 depends on THERMAL_GOV_POWER_ALLOCATOR
112 help
113 Select this if you want to control temperature based on
114 system and device power allocation. This governor can only
115 operate on cooling devices that implement the power API.
116
117 endchoice
118
119 config THERMAL_GOV_FAIR_SHARE
120 bool "Fair-share thermal governor"
121 help
122 Enable this to manage platform thermals using fair-share governor.
123
124 config THERMAL_GOV_STEP_WISE
125 bool "Step_wise thermal governor"
126 help
127 Enable this to manage platform thermals using a simple linear
128 governor.
129
130 config THERMAL_GOV_BANG_BANG
131 bool "Bang Bang thermal governor"
132 default n
133 help
134 Enable this to manage platform thermals using bang bang governor.
135
136 Say 'Y' here if you want to use two point temperature regulation
137 used for fans without throttling. Some fan drivers depend on this
138 governor to be enabled (e.g. acerhdf).
139
140 config THERMAL_GOV_USER_SPACE
141 bool "User_space thermal governor"
142 help
143 Enable this to let the user space manage the platform thermals.
144
145 config THERMAL_GOV_POWER_ALLOCATOR
146 bool "Power allocator thermal governor"
147 depends on ENERGY_MODEL
148 help
149 Enable this to manage platform thermals by dynamically
150 allocating and limiting power to devices.
151
152 config CPU_THERMAL
153 bool "Generic cpu cooling support"
154 depends on THERMAL_OF
155 help
156 Enable the CPU cooling features. If the system has no active
157 cooling device available, this option allows to use the CPU
158 as a cooling device.
159
160 if CPU_THERMAL
161
162 config CPU_FREQ_THERMAL
163 bool "CPU frequency cooling device"
164 depends on CPU_FREQ
165 default y
166 help
167 This implements the generic cpu cooling mechanism through frequency
168 reduction. An ACPI version of this already exists
169 (drivers/acpi/processor_thermal.c).
170 This will be useful for platforms using the generic thermal interface
171 and not the ACPI interface.
172
173 config CPU_IDLE_THERMAL
174 bool "CPU idle cooling device"
175 depends on IDLE_INJECT
176 help
177 This implements the CPU cooling mechanism through
178 idle injection. This will throttle the CPU by injecting
179 idle cycle.
180 endif
181
182 config CLOCK_THERMAL
183 bool "Generic clock cooling support"
184 depends on COMMON_CLK
185 depends on PM_OPP
186 help
187 This entry implements the generic clock cooling mechanism through
188 frequency clipping. Typically used to cool off co-processors. The
189 device that is configured to use this cooling mechanism will be
190 controlled to reduce clock frequency whenever temperature is high.
191
192 config DEVFREQ_THERMAL
193 bool "Generic device cooling support"
194 depends on PM_DEVFREQ
195 depends on PM_OPP
196 help
197 This implements the generic devfreq cooling mechanism through
198 frequency reduction for devices using devfreq.
199
200 This will throttle the device by limiting the maximum allowed DVFS
201 frequency corresponding to the cooling level.
202
203 In order to use the power extensions of the cooling device,
204 devfreq should use the simple_ondemand governor.
205
206 If you want this support, you should say Y here.
207
208 config THERMAL_EMULATION
209 bool "Thermal emulation mode support"
210 help
211 Enable this option to make a emul_temp sysfs node in thermal zone
212 directory to support temperature emulation. With emulation sysfs node,
213 user can manually input temperature and test the different trip
214 threshold behaviour for simulation purpose.
215
216 WARNING: Be careful while enabling this option on production systems,
217 because userland can easily disable the thermal policy by simply
218 flooding this sysfs node with low temperature values.
219
220 config THERMAL_MMIO
221 tristate "Generic Thermal MMIO driver"
222 depends on OF || COMPILE_TEST
223 depends on HAS_IOMEM
224 help
225 This option enables the generic thermal MMIO driver that will use
226 memory-mapped reads to get the temperature. Any HW/System that
227 allows temperature reading by a single memory-mapped reading, be it
228 register or shared memory, is a potential candidate to work with this
229 driver.
230
231 config HISI_THERMAL
232 tristate "Hisilicon thermal driver"
233 depends on ARCH_HISI || COMPILE_TEST
234 depends on HAS_IOMEM
235 depends on OF
236 default y
237 help
238 Enable this to plug hisilicon's thermal sensor driver into the Linux
239 thermal framework. cpufreq is used as the cooling device to throttle
240 CPUs when the passive trip is crossed.
241
242 config IMX_THERMAL
243 tristate "Temperature sensor driver for Freescale i.MX SoCs"
244 depends on ARCH_MXC || COMPILE_TEST
245 depends on NVMEM || !NVMEM
246 depends on MFD_SYSCON
247 depends on OF
248 help
249 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
250 It supports one critical trip point and one passive trip point. The
251 cpufreq is used as the cooling device to throttle CPUs when the
252 passive trip is crossed.
253
254 config MAX77620_THERMAL
255 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
256 depends on MFD_MAX77620
257 depends on OF
258 help
259 Support for die junction temperature warning alarm for Maxim
260 Semiconductor PMIC MAX77620 device. Device generates two alarm
261 interrupts when PMIC die temperature cross the threshold of
262 120 degC and 140 degC.
263
264 config QORIQ_THERMAL
265 tristate "QorIQ Thermal Monitoring Unit"
266 depends on THERMAL_OF
267 depends on HAS_IOMEM
268 help
269 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
270 It supports one critical trip point and one passive trip point. The
271 cpufreq is used as the cooling device to throttle CPUs when the
272 passive trip is crossed.
273
274 config SPEAR_THERMAL
275 tristate "SPEAr thermal sensor driver"
276 depends on PLAT_SPEAR || COMPILE_TEST
277 depends on HAS_IOMEM
278 depends on OF
279 help
280 Enable this to plug the SPEAr thermal sensor driver into the Linux
281 thermal framework.
282
283 config SUN8I_THERMAL
284 tristate "Allwinner sun8i thermal driver"
285 depends on ARCH_SUNXI || COMPILE_TEST
286 depends on HAS_IOMEM
287 depends on NVMEM
288 depends on OF
289 depends on RESET_CONTROLLER
290 help
291 Support for the sun8i thermal sensor driver into the Linux thermal
292 framework.
293
294 To compile this driver as a module, choose M here: the
295 module will be called sun8i-thermal.
296
297 config ROCKCHIP_THERMAL
298 tristate "Rockchip thermal driver"
299 depends on ARCH_ROCKCHIP || COMPILE_TEST
300 depends on RESET_CONTROLLER
301 depends on HAS_IOMEM
302 help
303 Rockchip thermal driver provides support for Temperature sensor
304 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
305 trip point. Cpufreq is used as the cooling device and will throttle
306 CPUs when the Temperature crosses the passive trip point.
307
308 config RCAR_THERMAL
309 tristate "Renesas R-Car thermal driver"
310 depends on ARCH_RENESAS || COMPILE_TEST
311 depends on HAS_IOMEM
312 help
313 Enable this to plug the R-Car thermal sensor driver into the Linux
314 thermal framework.
315
316 config RCAR_GEN3_THERMAL
317 tristate "Renesas R-Car Gen3 thermal driver"
318 depends on ARCH_RENESAS || COMPILE_TEST
319 depends on HAS_IOMEM
320 depends on OF
321 help
322 Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
323 thermal framework.
324
325 config KIRKWOOD_THERMAL
326 tristate "Temperature sensor on Marvell Kirkwood SoCs"
327 depends on MACH_KIRKWOOD || COMPILE_TEST
328 depends on HAS_IOMEM
329 depends on OF
330 help
331 Support for the Kirkwood thermal sensor driver into the Linux thermal
332 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
333
334 config DOVE_THERMAL
335 tristate "Temperature sensor on Marvell Dove SoCs"
336 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
337 depends on HAS_IOMEM
338 depends on OF
339 help
340 Support for the Dove thermal sensor driver in the Linux thermal
341 framework.
342
343 config DB8500_THERMAL
344 tristate "DB8500 thermal management"
345 depends on MFD_DB8500_PRCMU && OF
346 default y
347 help
348 Adds DB8500 thermal management implementation according to the thermal
349 management framework. A thermal zone with several trip points will be
350 created. Cooling devices can be bound to the trip points to cool this
351 thermal zone if trip points reached.
352
353 config ARMADA_THERMAL
354 tristate "Marvell EBU Armada SoCs thermal management"
355 depends on ARCH_MVEBU || COMPILE_TEST
356 depends on HAS_IOMEM
357 depends on OF
358 help
359 Enable this option if you want to have support for thermal management
360 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
361
362 config DA9062_THERMAL
363 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
364 depends on MFD_DA9062 || COMPILE_TEST
365 depends on OF
366 help
367 Enable this for the Dialog Semiconductor thermal sensor driver.
368 This will report PMIC junction over-temperature for one thermal trip
369 zone.
370 Compatible with the DA9062 and DA9061 PMICs.
371
372 config MTK_THERMAL
373 tristate "Temperature sensor driver for mediatek SoCs"
374 depends on ARCH_MEDIATEK || COMPILE_TEST
375 depends on HAS_IOMEM
376 depends on NVMEM || NVMEM=n
377 depends on RESET_CONTROLLER
378 default y
379 help
380 Enable this option if you want to have support for thermal management
381 controller present in Mediatek SoCs
382
383 config AMLOGIC_THERMAL
384 tristate "Amlogic Thermal Support"
385 default ARCH_MESON
386 depends on OF && ARCH_MESON
387 help
388 If you say yes here you get support for Amlogic Thermal
389 for G12 SoC Family.
390
391 This driver can also be built as a module. If so, the module will
392 be called amlogic_thermal.
393
394 menu "Intel thermal drivers"
395 depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
396 source "drivers/thermal/intel/Kconfig"
397 endmenu
398
399 menu "Broadcom thermal drivers"
400 depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
401 COMPILE_TEST
402 source "drivers/thermal/broadcom/Kconfig"
403 endmenu
404
405 menu "Texas Instruments thermal drivers"
406 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
407 depends on HAS_IOMEM
408 source "drivers/thermal/ti-soc-thermal/Kconfig"
409 endmenu
410
411 menu "Samsung thermal drivers"
412 depends on ARCH_EXYNOS || COMPILE_TEST
413 source "drivers/thermal/samsung/Kconfig"
414 endmenu
415
416 menu "STMicroelectronics thermal drivers"
417 depends on (ARCH_STI || ARCH_STM32) && OF
418 source "drivers/thermal/st/Kconfig"
419 endmenu
420
421 config TANGO_THERMAL
422 tristate "Tango thermal management"
423 depends on ARCH_TANGO || COMPILE_TEST
424 help
425 Enable the Tango thermal driver, which supports the primitive
426 temperature sensor embedded in Tango chips since the SMP8758.
427 This sensor only generates a 1-bit signal to indicate whether
428 the die temperature exceeds a programmable threshold.
429
430 source "drivers/thermal/tegra/Kconfig"
431
432 config GENERIC_ADC_THERMAL
433 tristate "Generic ADC based thermal sensor"
434 depends on IIO
435 help
436 This enabled a thermal sysfs driver for the temperature sensor
437 which is connected to the General Purpose ADC. The ADC channel
438 is read via IIO framework and the channel information is provided
439 to this driver. This driver reports the temperature by reading ADC
440 channel and converts it to temperature based on lookup table.
441
442 menu "Qualcomm thermal drivers"
443 depends on (ARCH_QCOM && OF) || COMPILE_TEST
444 source "drivers/thermal/qcom/Kconfig"
445 endmenu
446
447 config ZX2967_THERMAL
448 tristate "Thermal sensors on zx2967 SoC"
449 depends on ARCH_ZX || COMPILE_TEST
450 help
451 Enable the zx2967 thermal sensors driver, which supports
452 the primitive temperature sensor embedded in zx2967 SoCs.
453 This sensor generates the real time die temperature.
454
455 config UNIPHIER_THERMAL
456 tristate "Socionext UniPhier thermal driver"
457 depends on ARCH_UNIPHIER || COMPILE_TEST
458 depends on THERMAL_OF && MFD_SYSCON
459 help
460 Enable this to plug in UniPhier on-chip PVT thermal driver into the
461 thermal framework. The driver supports CPU thermal zone temperature
462 reporting and a couple of trip points.
463 endif